Electroplating important in manufacturing cofired multilayer ceramic modules and packagesSISOLAK, R.Electri.onics. 1983, Vol 29, Num 10, pp 25-26, issn 0745-4309Article

INNOVATIONS IN HYBRID PACKAGINGMARKSTEIN HW.1979; ELECTRON. PACKAG. PRODUCT.; USA; DA. 1979; VOL. 19; NO 9; PP. 40-44; (4 P.); BIBL. 1 REF.Article

PACKAGING A HIGH-DENSITY HYBRID MULTIPLEXER.POLIN D; WILLIAMSON M.1974; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1974; VOL. 14; NO 11; PP. 79-81Article

Variations in processing substrate with ccc'sBOCCIA, L. J.Electri.onics. 1984, Vol 30, Num 5, pp 20-24, issn 0745-4309Article

Automating thick film processes improves hybrid circuitsCUNDY, A. S.Electri.onics. 1983, Vol 29, Num 11, pp 27-30, issn 0745-4309Article

Optimum computer aided design for hybrid ICsKOHARA, H; USHIGOME, M; KAWASHIMA, S et al.NEC research & development. 1988, Num 91, pp 104-110, issn 0547-051XArticle

Nitrogen-filled storage cabinets avoid oxidation of hybrid componentsVOGEL, J.Electri.onics. 1983, Vol 29, Num 9, pp 29-30, issn 0745-4309Article

A new type hybrid IC in a transfer-molded standard packageNITTA, H; SASAMOTO, T; YAMANAKA, M et al.NEC research & development. 1988, Num 91, pp 65-72, issn 0547-051XArticle

Choosing an automatic component distribution system for hybrid circuit manufacturingPELLATON, J. P; GABUS, J.-C.Electri.onics. 1983, Vol 29, Num 7, pp 43-47, issn 0745-4309Article

Conception de circuits intégrés hybrides de générateurs de la gamme microondePETROV, G. V.Mikroèlektronika (Moskva). 1984, Vol 13, Num 2, pp 138-147, issn 0544-1269Article

How to select adhesives for hybrid circuit assemblyLEFEVER, D. W.Electri.onics. 1985, Vol 31, Num 3, pp 23-26, issn 0745-4309Article

Glazed ceramic substrate materials for a hybrid repeater in submarine cable systemMASUNO, K.Transactions of the Institute of Electronics and Communication Engineers of Japan. Section E. 1983, Vol 66, Num 6, pp 366-372, issn 0387-236XArticle

Using ultrasonics for cleaning hybrid circuitsARATA, D.Electri.onics. 1983, Vol 29, Num 13, pp 30-31, issn 0745-4309Article

Encres à base de métaux non nobles pour circuits hybrides à couches épaissesHINOUL, M; VERMEIRSCH, M; VLAEMINCK, R et al.Revue des Télécommunications. 1982, Vol 57, Num 2, pp 137-141, issn 0373-8582Article

The reliability of encapsulated and unencapsulated thick-film hybrid microcircuitsSUTHERLAND, R. R.Microelectronics. 1986, Vol 17, Num 4, pp 35-48, issn 0026-2692Article

Outlook for thick film hybrids for 1985-90MCCANDLISH, C. S; DOW, A. L.American Ceramic Society bulletin. 1985, Vol 64, Num 4, pp 547-548, issn 0002-7812Article

Application of the plasma spraying process to the production of metal-ceramics substrates for hybrid microelectronicsGORECKA-DRZAZGA, A; GOLONKA, L; PAWLOWSKI, L et al.Revue internationale des hautes températures et des réfractaires. 1984, Vol 21, Num 3-4, pp 153-165, issn 0035-3434Article

Trends in medical electronics using surface mounted components and hybridsHICKS, R. E; CHARLES, H. K. JR; WAGNER, G. D et al.Solid state technology. 1983, Vol 26, Num 12, pp 145-150, issn 0038-111XArticle

DEVELOPING A NANUFACTURING TECHNOLOGY FOR POWER HYBRIDSHAMILL AT; MARTHINUSS JE; RAZZETTI LA et al.1980; ELECTRON. PACKAG. PROD.; ISSN 0013-4945; USA; DA. 1980; VOL. 20; NO 9; PP. 72-76; 4 P.Article

THE LAYOUT OF LARGE HYBRIDS TO MAXIMIZE YIELDMYRVAAGNES B.1980; ELECTRON. PACKAG. PROD.; ISSN 0013-4945; USA; DA. 1980; VOL. 20; NO 10; PP. 77-80; 3 P.Article

THICK FILM AND HYBRID CIRCUITSBARNWELL PG.1980; NEW ELECTRON.; GBR; DA. 1980; VOL. 13; NO 11; PP. 90-93; (2 P.)Article

QUALITY AND RELIABILITY IN HYBRID CIRCUITSREAD RF.1979; EUROPEAN HYBRID MICROELECTRONICS CONFERENCE. 2/1978/GHENT; NLD; PIJNACKER: DUTCH EFFICIENCY BUREAU; DA. 1979; PP. 555-560Conference Paper

UNIVERSELLER FREQUENZTEILER IN HYBRIDTECHNIK = DIVISEUR DE FREQUENCE UNIVERSEL EN TECHNIQUE HYBRIDEWETZKO M; STREUBEL P; ALTHUS J et al.1979; RADIO FERNSEHEN ELEKTRON.; DDR; DA. 1979; VOL. 28; NO 1; PP. 19-21; BIBL. 8 REF.Article

HYBRID TECHNOLOGY-BEST SUPPORTING ACTOR.BOUCHARD JG.1977; I.E.E.E. TRANS. MANUFG TECHNOL.; U.S.A.; DA. 1977; VOL. 6; NO 4; PP. 65-68; BIBL. 9 REF.Article

RELIABILITY TESTING OF B.A.C. HYBRID CIRCUITS.TAYLOUR CH.1977; MICROELECTRON. AND RELIAB.; G.B.; DA. 1977; VOL. 16; NO 4; PP. 295-302; (SEMICOND. TECHNOL. ANNU. SEMINEX TECH. SEMIN. EXHIB.; LONDON; 1977)Conference Paper